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| PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm D B A SOT684-2 terminal 1 index area E A A1 c detail X C e1 e 15 L 14 1/2 e b 28 29 vMCAB wM C y1 C y e Eh 1/2 e e2 1 terminal 1 index area 56 Dh 43 42 X 0 2.5 scale E (1) 8.1 7.9 Eh 5.35 5.05 e 0.5 e1 6.5 e2 6.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 8.1 7.9 Dh 5.35 5.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT684-2 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-04-24 02-10-22 |
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